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Wireless/Telecom News Releases
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(Wireless-NewsWire.Com, October 17, 2016 ) Shipment value of the Taiwanese and Korean semiconductor industry totaled around NT$2.1 trillion (US$63.8 billion; US$1 = NT$32.8) and NT$1.6 trillion (US$48.6 billion), respectively, in 2014.
This made Taiwan and Korea the world's second and third largest semiconductor market, respectively, with the United States securing the first spot. The Taiwan's and Korea's share of shipment value in the global semiconductor industry reached 21% and 16%, respectively. This report provides an in-depth analysis of Taiwanese semiconductor industry in three areas: fabless IC design, wafer foundry and IC packaging and testing; provides a competitive analysis of semiconductor industry in Korea and Taiwan and examines their future outlook. Request for Sample @ http://www.reportsweb.com/inquiry&RW000160965/sample Table of Content Analysis of Taiwanese Semiconductor Industry4 1.1 Taiwanese Fabless IC Design Industry4 1.1.1 Overview of Listed/OTC Fabless IC Design Houses in Taiwan4 1.1.2 Role of the Taiwanese IC Design Industry in the World11 1.1.3 Importance of the Taiwanese IC Design Industry12 1.2 Taiwanese IC Manufacturing Industry14 1.2.1 Overview of Listed/OTC IC Manufacturing Companies in Taiwan14 1.2.2 Role of the Taiwanese IC Manufacturing Industry in the World16 1.2.3 Importance of the Taiwanese IC Manufacturing Industry19 1.3 Taiwanese IC Packaging & Testing Industry21 1.3.1 Overview of Listed/OTC IC Packaging & Testing Companies in Taiwan21 1.3.2 Role of the Taiwanese IC Packaging and Testing Industry in the World24 1.3.3 Importance of the Taiwanese IC Packaging and Testing Industry26 2. Competitive Analysis28 2.1 Global Presence of the Korean and Taiwanese Semiconductor Industry28 2.1.1 Fabless IC Design29 2.1.2 Wafer Foundry30 2.1.3 Memory32 2.1.4 Packaging and Testing34 2.2 Development of Leading Korean and Taiwanese Semiconductor Vendors35 2.2.1 Fabless IC Design37 2.2.2 Wafer Foundry38 2.2.3 Memory39 2.2.4 IC Packaging and Testing41 3. Review and Outlook42 3.1 Fabless IC Design42 3.2 Wafer Foundry44 3.3 IC Packaging and Testing45 Appendix47 Glossary of Terms47 Inquire for Discount @ http://www.reportsweb.com/inquiry&RW000160965/discount
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Source: EmailWire.Com
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